Theme 3: Mechanics of interfaces: Delamination and debonding
Microsystems combine many different materials (metals, polymers, ceramics) at the micronscale to achieve functional performance, however, the poor integrity of the resulting interfaces often compromises the systems’ reliability. Similarly, improved engineering materials are typically based on mixing different phases, yet the interface between the phases often limits their performance. Therefore, we have proposed, designed and explored various experimental and experimental-numerical methodologies to measure and simulate the (mixed-mode) interface behavior at the micronscale, including the miniature mixed-mode bending setup for in-situ delamination testing under SEM microscopic observation and Integrated Digital Image Correlation for mixed-mode interface parameter identification.
Microsystems combine many different materials (metals, polymers, ceramics) at the micronscale to achieve functional performance, however, the poor integrity of the resulting interfaces often compromises the systems’ reliability. Similarly, improved engineering materials are typically based on mixing different phases, yet the interface between the phases often limits their performance. Therefore, we have proposed, designed and explored various experimental and experimental-numerical methodologies to measure and simulate the (mixed-mode) interface behavior at the micronscale, including the miniature mixed-mode bending setup for in-situ delamination testing under SEM microscopic observation and Integrated Digital Image Correlation for mixed-mode interface parameter identification.