Oxford Polymer RIE

Reactive Ion Etching reactor for etching Polymer based materials like: Photo Resist, Polyimide and BCB using timed etch steps without endpoint detection.

Name

Oxford PlasmaLab System 100 Plymer RIE

Application

Etchback of Polymer based materials or Patterning of Polymer based materials with Dielectric or Photo Resist mask.

Etchback of Polyimide for planarization applications.

Characteristics

Baseline Recipes based on O2 / CHF3 chemistry with max 20% CHF3.

Reactive Ion Etch Reactor with automated Loadlock.

Specimen

Maximum 3 inch processing

User conditions

Requires training or supervision

Remarks

Etch rate depends on sample size and transmission. Preconditioning recommended.