Oxford Polymer RIE
Reactive Ion Etching reactor for etching Polymer based materials like: Photo Resist, Polyimide and BCB using timed etch steps without endpoint detection. | |
Name | Oxford PlasmaLab System 100 Plymer RIE |
Application | Etchback of Polymer based materials or Patterning of Polymer based materials with Dielectric or Photo Resist mask. Etchback of Polyimide for planarization applications. |
Characteristics | Baseline Recipes based on O2 / CHF3 chemistry with max 20% CHF3. Reactive Ion Etch Reactor with automated Loadlock. |
Specimen | Maximum 3 inch processing |
User conditions | Requires training or supervision |
Remarks | Etch rate depends on sample size and transmission. Preconditioning recommended. |