Oxford Polymer RIE
Reactive Ion Etching reactor for etching Polymer based materials like: Photo Resist, Polyimide and BCB using timed etch steps without endpoint detection.
Oxford PlasmaLab System 100 Plymer RIE
Etchback of Polymer based materials or Patterning of Polymer based materials with Dielectric or Photo Resist mask.
Etchback of Polyimide for planarization applications.
Baseline Recipes based on O2 / CHF3 chemistry with max 20% CHF3.
Reactive Ion Etch Reactor with automated Loadlock.
Maximum 3 inch processing
Requires training or supervision
Etch rate depends on sample size and transmission. Preconditioning recommended.