Name

Semi Automatic Mask Aligner EVG 620NT

Application

Photo lithography and aligning wafers to each other for bonding

Characteristics

500W lamp with broadband optics. Lithography alignment 1 micron, bond alignment accuracy under investigation. 5 inch mask possible to use, 6 inch preferred for optical litho

Specimen

3 inch maximum size, smaller pieces and 2 inch wafers possible for bond alignment. For optical litho maximum size is 4 inch

User conditions

After training the user will have to use the system by themselves

Remarks

For optical litho there is only 1 positive resist available.