Diamond tool scribers, Karl Suss and Loomis
Karl Suss, manual scriber ; Loomis PKR-99 ; Loomis LSD-100
Accurate positioning of scribe lines. cleaving of InP / GaAs wafers (smooth crystal plane cleaving for facets).
10-20 microns accuracy placement of scribelines. Automatic scribing possible
Wafer size < or = 3-inch InP / GaAs wafers
Only used by operator
Loomis LSD-100 in use as Break System ; In general: scribing only for InP / GaAs Monocrystalline Semiconductors.