Mechanical / chemical polishing
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Name | Logitech LP50/Wafer Substrate Bonding Unit |
Application | Substrate thinning. Within crystal cleaving, heat-sinking and reducing Ohmic resistance. |
Characteristics | Thinning down to 100±5 microns depending on sample-size and type of semiconductor InP or GaAs. |
Specimen | Maximum size of 4 inch pieces InP/GaAs. |
User conditions | Only used by operator |
Remarks | InP/GaAs-exclusively |