Mechanical / chemical polishing

 

Name

Logitech LP50/Wafer Substrate Bonding Unit

Application

Substrate thinning. Within crystal cleaving, heat-sinking and reducing Ohmic resistance.

Characteristics

Thinning down to 100±5 microns depending on sample-size and type of semiconductor InP or GaAs.

Specimen

Maximum size of 4 inch pieces InP/GaAs.

User conditions

Only used by operator

Remarks

InP/GaAs-exclusively