Name

Semi Automatic Wafer Bonder EVG 520IS

Application

Adhesive bonding of wafers/pieces to each other

Characteristics

Adhesive bonding and curing of the adhesive in an inert/vacuum environment

Specimen

3 inch maximum size, smaller pieces and 2 inch wafers possible

User conditions

After a short training users will have to use the system by themselves

Remarks

Alignment of two wafers to each other possible in combination with the EVG bondaligner and a backside pattern