Education and Research Technician (Design and Development)
Rainier van Dommele
Department
Electrical Engineering
EAISI
RESEARCH PROFILE
Rainier van Dommele received his B.Eng. degree in Engineering from the Fontys Hogeschool Eindhoven, The Netherlands. In 2007, he started as technician within the Radio communications (ECR) group at the Eindhoven University of Technology, The Netherlands. Since 2012 van Dommele has been technician within the Mixed-signal Microelectronics (MsM), now Integrated Circuits (IC) group at the Eindhoven University of Technology, The Netherlands.
Recent Publications
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Kaijie Ding,Dusan Milosevic,Vojkan Vidojkovic,Rainier van Dommele,Mark Bentum,Peter Baltus
A 23 G Hz RF-beamforming Transmitter with > 15.5 dBm Psatand >21.7% Peak Efficiency for Inter-satellite Communications
2022 IEEE Radio Frequency Integrated Circuits Symposium, RFIC 2022 (2022) -
Xi Zhang,Xiao Liu,Marc Spiegelberg,A. Rainier Van Dommele,Marion K. Matters-Kammerer
A DC-51.5 GHz electro-absorption modulator driver with tunable differential DC coupling for 3D wafer scale packaging
2nd IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2019 (2019) -
Bindi Wang,Hao Gao,A. Rainier van Dommele,Marion K. Matters-Kammerer,Peter G.M. Baltus
60-GHz low-noise VGA and interpolation-based gain cell in a 40-nm CMOS technology
IEEE Transactions on Microwave Theory and Techniques (2019) -
Xiao Liu,Xi Zhang,Rainier van Dommele,Hao Gao,Domine Leenaerts,Marion K. Matters-Kammerer
A DC to 40 GHz 4-Vpp output high-efficiency linear driver for optical communication
2018 Asia-Pacific Microwave Conference, APMC 2018 (2019) -
Xi Zhang,Xiao Liu,A.R. van Dommele,Marion K. Matters-Kammerer
Dual-channel 56 Gb/s PAM-4 electro-absorption modulator driver for 3D wafer scale packaging
2018 Asia-Pacific Microwave Conference, APMC 2018 (2019)
Ancillary Activities
No ancillary activities