prof.dr. F. (Fred) Roozeboom - Expertise
P.O. Box 513
5600 MB EINDHOVEN
Share / Bookmark
- D14320 - Microelectronics
Fred Roozeboom received his MSc in chemistry (cum laude) from Utrecht University, The Netherlands in 1976, and his PhD in chemical engineering in 1980 at Twente University (Enschede, The Netherlands) on topics in catalysis. From 1980-1983 he worked on zeolite catalysis with Exxon R&D Labs in Baton Rouge, USA (1980-1982) and with Exxon Chemicals in Rotterdam (1983). In 1983 he joined Philips Research (since 2006: NXP Research) in Eindhoven, The Netherlands, where his early work encompassed MOCVD of III-V semiconductor lasers (1983-1988), IC metallization materials deposition and processing (1988-1990) and on bulk ferrite and thin-film soft-magnetic materials for magnetic recording (1990-1996). In 1996 he has been working on MBE of ultrathin magnetic and “switchable mirror” hydride multilayers. From 1997 to 2009 he led a team working on passive and heterogeneous integration, in particular on viahole technology and 3D integration for application in System-in-Package products and on high-value passives in silicon for application in wireless communication, power management and digital signal processing. Two technology transfers on 3D passive integration (PICS® wireless technology) to the Philips/ NXP Semiconductor plants in Caen, France (now IPDiA) and ASMC’s foundry in Shanghai, China resulted in over 350 M€ accumulated sales in the 2003-2008 period. For part of this work he received the Bronze Award of the ‘NXP Invention of the Year 2007’ and became an NXP Research Fellow in 2007.
In 2007 he became also a part-time professor at the Department of Applied Physics of the University of Technology in Eindhoven, The Netherlands, in the group Plasma and Materials Processing. In 2009 he left NXP, and joined TNO, Eindhoven, the Netherlands as a senior technical advisor working in a team specializing in spatial Atomic Layer Deposition and other high-speed processing, e.g. Atomic Layer Etching. In 2011, the spatial processing team at TNO received the 2nd EARTO Innovation Prize Award. In 2014 he was elected Fellow of the Electrochemical Society ‘for pioneering work in semiconductor processing and thin film technology’.
Fred has authored or co-authored over 210 journal and conference publications and 5 book chapters, holds 30 granted US patents and approximately 35 other WO patent applications, and is the editor or co-editor of 35 conference proceedings on semiconductor processing. His h-index is 31 (Web of Science, Jan. 2016). He serves as a member-at-large of the Electronics and Photonics Division of the Electrochemical Society, and was a member of the ENIAC advisory committee to the European Commission (subcommittee “Beyond CMOS”), the IMAPS Benelux committee, the scientific advisory board of several EU-projects, and a founding committee member of the Dutch national STW-Thin Film Nanomanufacturing program (2008). He also served as Meeting Chair of the Materials Research Society (MRS) Fall 2003 Meeting and as a member of the MRS Strategic Program Development Subcommittee.
Topics of interest: ultrathin-film technology, plasma processing, atomic layer processing, spatial ALD (incl. roll-to-roll), RTP, reactive ion etching, atomic layer etching, 3D passive and heterogeneous integration, microsystem technology, Li-ion micro-batteries, sensors, displays.
Job objective: To merge his industrial expertise and leadership in micro- and nanotechnology and academic ambition into a mutually rewarding combination with focus on bringing advanced semiconductor and related processing into system-level applications.