4K200 - Mechanics of micro-electronics

Contents

Microelectronic components contain a number of materials exhibiting a large variety in size and thermo-mechanical behaviour. The reliability and lifetime of these products are mainly determined by a delicate interplay between these different materials. For this reason, understanding the thermo-mechanics of these materials as well as the occurring failure mechanisms is essential for successful future developments in microelectronics.

The following topics are addressed in the course:

  • Introduction into the world of microelectronics
  • Overview of all relevant failure phenomena in microelectronics
  • Thermo-mechanics of thin films, integrated circuits and packages
  • The physics and mechanics of occurring failure phenomena in microelectronic components, e.g. interface fracture between two materials ('delamination') and thin film buckling, by combining analytical and numerical models with experimental methods
  • Virtual thermo-mechanical prototyping and qualification of microelectronic components
  • Future developments and challenges in microelectronics

Learning objectives

  • To understand the thermo-mechanical behaviour of typically applied materials in microelectronics, including the size dependency and occurring relevant failure mechanisms.
  • To learn how to apply numerical, analytical and experimental methods and models to describe the thermo-mechanics of and failure phenomena in microelectronic components.