A multi-scale approach toward integrated cohesive interface elements
Copper-rubber interfaces play a major role in a variety of products, such as stretchable electronics. Interface delamination causes failure of the product.
An important delamination mechanism is fibrillation.
During peeling, the dissipation mechanisms depend on the loading conditions, rendering the experimentally determined interface properties intrinsically case-specific. This hinders the development of generally applicable predictive models. In this research a multi-scale approach is developed where the fibrillation micromechanics is explicitly taken into account in the macroscopic interface description, leading to generally applicable predictive interface models.
Cohesive zones (CZs) are used to describe the interface behavior on the macro-scale. The CZ traction-opening relation is obtained from the underlying micromechanical model, where the relevant mechanisms, such as fibril debonding and roughness, are taken into account.