Parallel plate RIE with chlorine/freon chemistries

Name

Oxford PlasmaLab System 100 RIE

Application

Testing of chlorine/freon etch processes/etching of GaAs

Characteristics

SiCl4/Cl2/CHF3/CF4/SF6/O2/Ar

Specimen

Maximum size is 4 inch wafers. Note: homogenity 10% over 3 cm.

User conditions

Only used by operator

Remarks

Ectching depth limited, typical etch rates: angstroms/s. No toxic materials allowed.