Transport along interfaces in microelectronics and LED packages (TRACES)

This proposal aims at a fundamental understanding of water and ion transport along the interfaces found in microelectronics and light emitting diode (LED) packages. Microelectronics and LEDs are generally encapsulated by polymers in order to protect the underlying electric circuit from environmental hazards, and to establish electrical connections. The interfaces within these packages, such as those between the metal bond wires and the polymer, provide pathways for water and ionic contaminants to reach the delicate electric circuit. Once the electric circuit is reached the combination of water and ions will provoke corrosion of metallizations, which is a major reliability risk for polymer encapsulated microelectronics and LEDs. The risk of corrosion is difficult to predict during the design phase due to the limited fundamental knowledge on the (physico)chemical processes underlying the transport of water and ions along interfaces. This project will study the interfacial over many length scales to enable prediction of durability.  

NXP and Philips lighting are participating and sponsoring this STW project.