EFFECT Photonics was founded in 2010 and is a spin-off from TU/e. It designs and produces highly integrated optical communication products based on Dense Wavelength Division Multiplexing (DWDM) optical System-on-Chip technology and inexpensive packaging techniques. EFFECT takes a platform approach to photonic integration by using highly productive building blocks within the wafer. By growing several quaternary alloys of indium phosphide on a single wafer, all active and passive optical functions can be combined in one photonic integrated circuit (PIC). This, combined with their proprietary packaging technology, designed for volume, means they can scale cost-effectively right from the start. Extensive development and European funding have already been invested to develop and refine the processes required to integrate multiple optical functions within a single chip. CEO James Regan says, "The industry is once again experiencing a tremendous growth cycle for optical components, driven by the deployment of 5G mobile networks, the increased demand for bandwidth, technological innovations such as augmented reality, unmanned cars and high-definition video streaming, just to name a few. To name a few, our high quality products address the need for low cost DWDM solutions and high bandwidth required in Next Generation Mobile, Metro Access Networks and Data Center Interconnects."