BVR2008 FC Electron Beam Evaporator

Name

BVR 2008FC Evaporator

Application

Deposition of thin metal films for electrical contacts and metal masking layers

Characteristics

Deposition of thin layers (layer stacks) of Ti, Au, Ge, Ni, Ag and Cr in the range of 10-200 nm.

Specimen

Maximum wafer size 3 inch.

User conditions

Requires training or supervision

Remarks