BVR2008 FC Electron Beam Evaporator
Name | BVR 2008FC Evaporator |
Application | Deposition of thin metal films for electrical contacts and metal masking layers |
Characteristics | Deposition of thin layers (layer stacks) of Ti, Au, Ge, Ni, Ag and Cr in the range of 10-200 nm. |
Specimen | Maximum wafer size 3 inch. |
User conditions | Requires training or supervision |
Remarks |
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