Oxford Nitride RIE
Reactive Ion Etching reactor for etching Dielectric Materials like: Si-Nitride and Si-Oxide using timed etch steps without endpoint detection. | |
Name | Oxford PlasmaLab System 100 Nitride RIE |
Application | Patterning of silicon nitride and silicon oxide layers with photo resist mask for waveguide definition. |
Characteristics | Baseline recipes based on O2 / CHF3 chemistry with max 100% CHF3. |
Specimen | Max 3 inch processing |
User conditions | Requires training or supervision |
Remarks | Pst etch plasma cleaning required. |