Olaf van der Sluis
Olaf van der Sluis is an Associate Professor and chair of Failure Mechanics of Microelectronic Devices in the Mechanics of Materials group at the Eindhoven University of Technology (TU/e) Department of Mechanical Engineering. His research interests include fracture mechanics, mechanics and adhesion of thin films, multi-scale mechanics, and lifetime prediction of microelectronic devices (rigid, flexible, and stretchable). The goal is two-fold: (1) identify and understand the most relevant failure phenomena that govern the complex behaviour of devices during processing, qualification and usage; (2) support and accelerate the design of functional and structurally robust products. These topics are motivated by his industrial position at Philips. In 2001, he joined Philips CFT (which became Philips Applied Technologies in 2005) working on various topics such as non-local ductile damage material models and computational homogenisation for metal forming processes, as well as fracture mechanics and lifetime prediction of microelectronics devices.
Olaf van der Sluis obtained his PhD in continuum-based multi-scale modelling of materials in 2001 at TU/e. Between 2008 and 2009, he was part-time Assistant Professor at Delft University of Technology. In 2010, he was appointed Assistant Professor at the Mechanics of Materials group at TU/e, and in 2015 he became part-time Associate Professor in the same group. In 2011, he joined Philips Research as a senior scientist. Here, he has been working on computational modelling of critical failure mechanisms in medical devices and imaging systems, in order to understand and predict lifetime and optimise reliability through a combination of numerical and experimental tools. He was involved in or in charge of several EU-funded research projects and serves as an expert evaluator for the European Commission. He is a reviewer of 20 international scientific journals. Olaf van der Sluis received the Philips Research Outstanding Achievement Award 2017.
Mixed-mode cohesive zone parameters from integrated digital image correlation on micrographs onlyInternational Journal of Solids and Structures (2019)
Advances in delamination modeling of metal/polymer systems: continuum aspectsNanopackaging (2018)
Advances in delamination modeling of metal/polymer systems: atomistic aspectsNanopackaging (2018)
A bulge test based methodology for characterizing ultra-thin buckled membranesThin Solid Films (2018)
From fibrils to toughness: Multi-scale mechanics of fibrillating interfaces in stretchable electronicsMaterials (2018)
Current Educational Activities
- 80% Philips Research, 20% TU/e, Koninklijke Philips Nederland