Processing equipment
Processing Equipment
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Temescal FC2000 Electron Beam Evaporator
Deposition of thin layers (layer stacks) of Ti, Pt and Au in the range of 10-200 nm. Loadlock.
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BVR2008 FC Electron Beam Evaporator
Deposition of thin layers (layer stacks) of Ti, Ag, Au, Ge, Ni and Cr in the range of 10-200 nm. Loadlock
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AJA Magnetron Sputtering Tool
Sputtering of Au, Ti, Ni, Cr, Pt ; RF-sputtering of isolators ; reactive gas sputtering of NbN.
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Roth & Rau Ion Beam Etcher
Ion beam milling reactor with argon. Applied with a magnetron sputter source for SiO2 and a SIMS eindpoint detector.
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ASML Pass 5500/1100B scanner
ASML ArF Scanner
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ASML Pass 2500/40 stepper
I-Line (365nm) stepper with working resolution of 0.7 micron
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Oxford ICP
Inductively Coupled Plasma etcher for optical devices
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Oxford Oxide/Nitride ICP PECVD
PE-CVD reactor in which the plasma is generated by an ICP-source. The system is equipped with a loadlock.
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Oxford Oxide/Nitride PECVD
Deposition of nitride and oxide. Deposition of etching mask layers.
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Oxford Nitride RIE
Reactive Ion Etching reactor for etching Dielectric Materials like: Si-Nitride and Si-Oxide using timed etch steps without...
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Oxford Polymer RIE
Reactive Ion Etching reactor for etching Polymer based materials like: Photo Resist, Polyimide and BCB using timed etch steps...
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Oxford General Purpose RIE
Parallel plate RIE with chlorine/freon chemistries Used for general purposes
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Sentech InP ICP Reactive Ion Etcher
Sentech InP ICP Reactive Ion Etcher
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Logitech Chemical Mechanical Polisher (CMP)
Logitech Chemical Mechanical Polisher (CMP)
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Semi Automatic Mask Aligner EVG 620NT
Semi Automatic Mask Aligner EVG 620NT
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Karl Suss MA-6 contact aligner
High Resolution Photolithography in a vacuum-contact mode
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