Selective atomic-scale processing for fabrication of nanoelectronics
It is a long held dream in nanoscience to synthesize materials from the bottom-up with atomic-level control of structure and properties, yet the fabrication of nanoelectronics still relies almost completely on top-down processing. From a technological point-of-view, the motivation for working on bottom-up fabrication is that conventional top-down processing relying on photolithography and etching is reaching its limits in terms of alignment accuracy. Our research focuses on the development of new approaches for area-selective ALD based detailed insights from plasma physics and surface chemistry. Area-selective ALD aims at deposition of material only on surfaces where it is needed, without coating other surfaces of different materials, and thereby enables self-aligned fabrication. In addition, we are exploring other flavors of selective processing such as topographically-selective deposition or atomic-scale cleaning.
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Recent Publications
Our most recent peer reviewed publications
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Surface Smoothing by Atomic Layer Deposition and Etching for the Fabrication of Nanodevices
ACS Applied Nano Materials (2022) -
Packing of inhibitor molecules during area-selective atomic layer deposition studied using random sequential adsorption simulations
Journal of Vacuum Science and Technology A: Vacuum, Surfaces, and Films (2022) -
Foundations of atomic-level plasma processing in nanoelectronics
Plasma Sources Science and Technology (2022) -
Foundations of atomic-level plasma processing in nanoelectronics
Plasma Sources Science and Technology (2022) -
Investigation of glucose electrooxidation mechanism over N-modified metal-doped graphene electrode by density functional theory approach
Journal of Computational Chemistry (2022)